MACOM X-Band Core Chip
Photo: Business Wire

[Via Satellite 09-25-13] Macom Technology Solutions (Macom) has released its new X-Band Core Chip (MAMF-011015), product of a joint investment between Macom and FIRST RF Corporation. The integrated core chip for the 8 GHz to 11 GHz frequency range, is a highly integrated solution setting new standards for size, weight, and performance (SWaP) enabling the next generation of radar system design.

The X-Band Core Chip integrates a Complementary metal-oxide-semiconductor (CMOS) logic driver with a GaAs Transmit/Receive Monolithic Microwave Integrated Circuit (MMIC) within a single quad-flat no-leads package. The surface mount 7x7mm plastic package offers a cost-effective, easy to implement solution.

The packaged device comprises of a common leg circuit, which includes digital attenuators, phase shifters, a low noise receive chain, and a transmit driver amplifier, as well as a CMOS logic driver. This integrated circuit uses MACOM’s advanced 0.25um PHEMT process, which has been optimized for high power and low noise amplifiers, passive and control components and allows for a high level of integration on a single MMIC.