October 31, 2023
EnSilica is to partner with VITES to supply its new beam-former chip for satellite user terminals. The two companies announced the collaboration on Oct. 30. VITES will use the chip at the heart of its new ViSAT-Ka-band terminal. EnSilica’s beam-forming chip is optimized to enable VITES’s creation of power- and cost-efficient ground-based flat panel user...
Technology