[Satellite TODAY 08-27-10] Sensio Technologies has partnered with 3-D-capable set-top box and TV semiconductor solutions provider Trident Microsystems to integrate Sensio’s 3-D technology into Trident’s products, the companies announced Aug. 27.
    The first Trident products to feature Sensio technology will be the TV550 3D TV system-on-chip unit, which will be followed by the release of new 3-D chips featuring Sensio technology for 3-D TVs.
The companies said the technology partnership was initiated to reflect industry demand for a high-end 3-D viewing experience in the home.
    “The upgrade of our FRC coprocessors and a front-end system-on-chip with Sensio 3-D will equip these products to support the highest quality in 3-D broadcast and streaming video. Our goal is to deliver an immersive visual 3D experience with cost-effective implementations,” Trident Microsystems President Christos Lagomichos said in a statement.